My-TX
Team 527: Mini-ITX Computer Case
Department of Mechanical Engineering

Entreprenural Advisor: Dr. Michael Devine

Thermal Advisor: Dr. Juan Ordonez

Sponsor: FAMU-FSU College of Engineering Dean's Office

ABOUT OUR PRODUCT


The goal of this project is to design a Mini-iTX small form factor computer case capable of cooling the components inside. Components of primary concern are the central processing unit (CPU) and the graphics processing unit (GPU). These components are extremely powerful and thermally sensitive. To maintain optimal performance they must be kept cool under standard operating conditions. The desired performance targets needed from these devices requires the CPU to maintain a temperature less than 50 °C and the GPU to maintain a temperature less than 70 °C. To do this, our case design utilizes a parallel flow water cooling loop. Water is pumped from a single reservoir and diverted separately to the CPU and GPU. Following heat transfer between the CPU/GPU and specific cooling blocks, the flow is rejoined and fed through an internal radiator. The water reservoir has been integrated into the side of the computer case to save internal space and provide additional cooling power. This product is aimed at high performance gaming industry which uses machines of similar power regularly and would directly benefit from a smaller portable form while maintaining the same level of power they desire. The design of our case and cooling systems has been made modular to fit any set of CPU and GPU the user requires and supplies themselves. All of these features have allowed the case volume to remain competitive with similar products on the market with the added benefit of water cooling and full-size GPU capabilities.

Key features of our product

Snowflake

Cooling Capabilities

Cooling capabilities for a full sized PSU, referenced size GPU, with an internally crafted reservoir.

Puzzle Piece

Compatability

Works with reference sized GPU, standard Mini-ITX motherboard, space for 2.5" SSD, internal cooling

Design

The design of our case had been created with the customer in mind. It will contain an integrated cooling system which minimizes the volume, all while having an internal power supply!

Cost

This project is being conducted with a budget of $1000, which was gracefully given to us by the FAMU-FSU COllege of Engineering Dean's Office. This money allows us to buy components for testing and the material to create a revolutionary Mini-ITX case and cooling system!

We know design.

Our design comes at under 11L which gives any user the opportunity to use any referenced size GPU, and Mini-ITX motherboard, and so much more. If you have no idea how small we are talking, take a look at the case compared to an Iphone X!

View Our Works

Engineering Shark Tank

THE TEAM

The ones who runs this company

Paul

Paul Hromadka

Team Leader & Systems Engineer

As Team Leader I am responsible for all purchasing and time line aspects of the project. Responsibilities involved include filling out purchasing requisitions, balancing the budget, tracking purchases and deliveries, scheduling meetings with both the team and advisors, and submitting all deliverables required of the team. As Systems Engineer I work closely with thermal and design leads to ensure that all systems being integrated into the case environment are compatible and done in the most efficient way possible.

Patrick Huffman

Patrick Huffman

Lead Thermal Designer

As the thermal lead for the project, I am in charge of any and all thermal calculations regarding the cooling system in the computer case. This includes designing a thermal circuit, determining heat output, radiator selection, flow speed, and much more. I work closely with William Pineda, our team’s design engineer, to ensure that the cooling system will be able to seamlessly integrate with the computer case geometry.

William Pineda

William Pineda

Lead Design Engineer

Being the lead design engineer, I will ensure the design of the case corresponds with the thermal integration and still functions as a computer case. This means that there will be enough space allocated for a users GPU, motherboard, harddrives, ram, radiator, and tubing network. The main challenge is ensuring we maintain a small form factor, while properly cooling high performing parts, in a highly portable case.

Fabrizio Alvarado

Fabrizio Alvarado

Marketing & Business

I will cover most of the financial aspect of the project and will also determine the specific target market and possible profits. It will also include the possible sales and manufacturing cost of the recurring year, if mass production was the desired outcome. The goal is to be able to produce the case with the least amount of processes, being able to cut various costs/time allowing us to do a considerable business. Also, we are aiming to advertise correctly in the start of this business by targeting locations like gamers conventions, where the new product is exposed, in order to maximize sales from the beginning.

OUR WORK

Rendered Design

render1 render2 render3

Thermal Design Schematic

thermal_2 thermal_3
It is vital to keep the CPU and GPU from overheating. Aside from catastrophic system failure, over heating can lead to lower performance output from the components. Gamers need to have steady state cooling for running high powered games so that they can operate at peak efficiency. The parallel cooling loop was designed to bring coolant to the GPU and CPU simultaneously rather than one after the other. By doing so, the temperature of the coolant will be the same at each cooling block. The loop is designed to cool a total TDP of ~400 Watts between the GPU, CPU, and any heat that the pump itself adds to the system (typically no more than 25 Watts).

Testing

CPU Comsol Model
CPU_Cool CPU_Mid CPU_Hot
CPU Comsol model showing cooling in the CPU water block under maximum operating conditions

GPU Comsol Model
GPU_Cool GPU_Mid GPU_Hot
GPU Comsol model showing cooling in the GPU water block under maximum operating conditions

Deliverables

*Manual currently contains: Project Scope, Customer Needs, Functional Decomposition, Target Catalog, Target Summary, Concept Generation, Concept Selection, and Project Plan

Manuals Presentations Photos Models

Manual

VDR1

Basic Thermal Schematic

Coming Soon

VDR2

Poster

DR4

DR5

DR6

×

Current Progress

To the right you will find a percentage bar which represents the teams status for our current three major challenges. The main focuses, as of April 5th 2019 is ensuring that the case comes in time for Senior Design Day and ensuring the system runs properly. Testing will take place once the case is in to ensure the system is cooled properly.

Design Progress

100%

Snowflake Thermal Design

100%

Purchasing

100%

Features

Comparing our customer needs to our final product

  • Customer Targets
  • CPU Max Temperature: 50℃
  • GPU Max Temperature: 70℃
  • Internal Power Supply
  • Volume: 7.5L
  • 2 SSD Slots
  • Weight: 4.5kg
  • Final Features
  • CPU Max Temperature: xx℃
  • GPU Max Temperature: xx℃
  • Internal Power Supply
  • Volume: 10.96L
  • 2 SSD Slots
  • Weight: x.xkg

FUTURE WORK

We still need to do the following

  • Protocase Ordered, should arrive next week
  • Physical Testing
  • Model Refinement
  • Data Analysis
  • Finalize Finished Product/Preparation for Engineering Design Day